Summary of Role:
We are seeking an experienced candidate with a foundation in device physics to join our team. The successful candidate will work on all aspects related of semiconductor devices for the primary application of thermal inkjet printing. Primary duties will include development of new semiconductor device designs and drive improvements in fabrication, packaging and processing of thermal inkjet devices.
Responsibilities:
Apply software tools to design and model performance of semiconductor devices
Design, measure and characterize semiconductor devices and test structures
Collect measurement data and propose process changes to optimize devices
Work closely with team members in circuit design, wafer processing & packaging to develop new semiconductor device design
Design and conduct experiments to demonstrate new device performance and reliability
Design, implement, and characterize ESD protection devices and strategies for various IC products and interconnect systems
Extract and maintain spice model libraries for semiconductor devices
Work with foundries to add new devices and their models for design tools and to analyse device issues and drive appropriate improvements
Education and Work Experience:
Minimum of MS, PhD preferred, in Electrical Engineering, Physics or related scientific discipline
5+ years of industry experience for senior level, or equivalent
Experienced designing semiconductor devices, particularly high voltage, power, non-volatile, and ESD
Experience with semiconductor device and process modeling software such as Sentaurus, Victory, Cogenda
Experience with semiconductor modelling software such as Utmost IV and IC-CAP
Experienced with software such as JMP, Tableau, SPSS, Python, and Matlab
Knowledgeable in semiconductor fabrication, device testing and packaging
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